Integrated circuit failure analysis : a guide to preparation techniques /
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| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English German |
| Published: |
Chichester ; New York :
Wiley,
c1998.
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| Series: | Wiley series in quality and reliability engineering
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| Subjects: | |
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Table of Contents:
- Purpose and importance of preparatory semiconductor analysis
- Opening the package. Chip insulation
- Wet chemical etching procedures for removing layers of the chip structure
- Crystallographic etching in the silicon
- Dry etching the plasma
- Microsectioning technology, metallography
- Appendix 1: advice on health and safety at work
- Appendix 2: list of manufacturers and suppliers