Integrated circuit failure analysis : a guide to preparation techniques /

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Bibliographic Details
Main Author: Beck, Friedrich
Format: Book
Language:English
German
Published: Chichester ; New York : Wiley, c1998.
Series:Wiley series in quality and reliability engineering
Subjects:
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100 1 |a Beck, Friedrich.  |9 38 
240 1 0 |a Präparationstechniken für die Fehleranalyse an integrierten Halbleiterschaltungen.  |l Inglés 
245 1 0 |a Integrated circuit failure analysis :  |b a guide to preparation techniques /  |c Friedrich Beck ; translated by Stephen S. Wilson. 
260 |a Chichester ;  |a New York :  |b Wiley,  |c c1998. 
300 |a xiv, 173 p. :  |b il. ;  |c 24 cm. 
440 0 |a Wiley series in quality and reliability engineering  |9 39 
504 |a Incluye bibliografía e índice analítico. 
505 0 |a Purpose and importance of preparatory semiconductor analysis -- Opening the package. Chip insulation -- Wet chemical etching procedures for removing layers of the chip structure -- Crystallographic etching in the silicon -- Dry etching the plasma -- Microsectioning technology, metallography -- Appendix 1: advice on health and safety at work -- Appendix 2: list of manufacturers and suppliers 
650 0 |a Circuitos integrados  |9 40 
650 0 |a SEMICONDUCTORES  |9 41 
650 0 |a Fallos  |9 42 
650 0 |a Ensayos  |9 43 
650 0 |a Electronica  |x Confiabilidad  |9 44 
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