Similar Items: Ab initio study of the cohesive properties, electronic structure and thermodynamic stability of the Ni-In and Ni-Sn intermetallics
- Predicting the vibrational contribution to thermal and EOS properties of Ni3X (X=In,Sn) intermetallic compounds
- Modelado computacional de intermetálicos binarios de los sistemas Cu-In-Sn y Ni-In-Sn para aplicaciones en tecnologías de unión libres de Pb.
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- Adhesion and cohesion : [proceedings].
Author: Ramos, Susana Beatriz
Author: Deluque Toro, Crispulo Enrique
- Modelado computacional de intermetálicos binarios de los sistemas Cu-In-Sn y Ni-In-Sn para aplicaciones en tecnologías de unión libres de Pb.
- Ab initio study of the cohesive properties, electronic structure and thermodynamic stability of the Ni-In and Ni-Sn intermetallics
- Predicting the vibrational contribution to thermal and EOS properties of Ni3X (X=In,Sn) intermetallic compounds